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JOEN LIH MACHINERY CO.,LTD.
Products Name:
JL-200SCGCNC Surface Grinder
Products Infomation:
An introduction to wafer grinding
The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially designed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel - the water is sucked onto an air floating table.
Applications
This machine is designed for precision grinding for various workpiece materials, such as, wafers, ceramics, quartz, glass and gems, etc.
Outsitading features
The motor is built in the air floating spindle. High spindle running accuracy reaches 0.1 µ m.
The air floating table meets rigorous requirements for grinding accuracy. Table rotation accuracy reaches 0.1 µ m.
Feed resolution on the Z axis is 0.1 µ m.
Minimum feed rate is 10 µ m/min.
Rapid traverse rate: 300 mm/min.
Advanced powerful Fanuc Oi controller features full digital control.
